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Effects of Surface Hydration State and Application Method on the Bond Strength of Self-etching Adhesives to Cut Enamel
Universidade Estadual Paulista (UNESP)
Purpose: To evaluate the effect of surface hydration state and application method on the microtensile bond strength of one-step self-etching adhesives systems to cut enamel.Materials and Methods: One hundred ninety-five bovine teeth were used. The enamel on the buccal side was flattened with 600-grit SiC paper. For the control group, 15 teeth received Adper Single Bond 2, applied according to manufacturer's recommendations. The other specimens were divided into three groups according to the adhesive system used: Futura Bond M (FM; Voco), Clearfil S-3 Bond (CS; Kuraray), and Optibond All in One (OA; Kerr). For each group, two hydration states were tested: D: blown dry with air; W: the excess of water was removed with absorbent paper. Two application methods were tested: P (passive): the adhesive was simply left on the surface; A (active): the adhesive was rubbed with an applicator point. A coat of Grandio composite resin (Voco) was applied on the surface. The teeth were sectioned to obtain enamel-resin sticks (1 x 1 mm), which underwent microtensile bond testing. The data in MPa were submitted to a three-way ANOVA and Tukey's test (alpha = 5%).Results: The ANOVA showed significant differences for application method and the type of adhesive, but not for hydration state. For the application method, the results of Tukey's test were: P: 31.46 (+/-7.09)a; A: 34.04 (+/-7.19)b. For the type of adhesive, the results were: OA: 31.29 (+/-7.05)a; CS: 32.28 (+/-7.14)a; FM: 34.68 (+/-7.17)b; different lower-case letters indicate statistically significant differences.Conclusion: Active application improved the bond strength to cut enamel. The adhesive Futurabond M showed the highest bond strength to cut enamel.
Issue Date: 
Journal of Adhesive Dentistry. Hanover Park: Quintessence Publishing Co Inc, v. 14, n. 1, p. 25-30, 2012.
Time Duration: 
Quintessence Publishing Co Inc
  • enamel
  • microtensile bond strength
  • self-etching adhesives
  • resin composite
Access Rights: 
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Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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