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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/130388
Title: 
Electrical and Mechanical Properties of Post-annealed SiC(x)N(y) Films
Author(s): 
Institution: 
  • Instituto Tecnológico de Aeronáutica (ITA)
  • Universidade Estadual Paulista (UNESP)
  • Universidade de São Paulo (USP)
ISSN: 
0255-5476
Abstract: 
Amorphous SiC(x)N(y) films have been deposited on (100) Si substrates by RF magnetron sputtering of a SiC target in a variable nitrogen-argon atmosphere. The as-deposited films were submitted to thermal anneling in a furnace under argon atmosphere at 1000 degrees C for 1 hour. Composition and structure of unannealed and annealed samples were investigated by RBS and FTIR. To study the electrical characteristics of SiC(x)N(y) films, Metal-insulator-semiconductor (MIS) structures were fabricated. Elastic modulus and hardness of the films were determined by nanoindentation. The results of these studies showed that nitrogen content and thermal annealing affect the electrical, mechanical and structural properties of SiC(x)N(y) films.
Issue Date: 
1-Jan-2009
Citation: 
Materials Science Forum, v. 615 617, p. 327-330.
Time Duration: 
327-330
Publisher: 
Trans Tech Publications Ltd
Keywords: 
  • Silicon carbon nitride
  • Thermal annealing
  • Resistivity
  • Elastic modulus
  • Hardness
Source: 
http://www.scientific.net/MSF.615-617.327
URI: 
Access Rights: 
Acesso restrito
Type: 
outro
Source:
http://repositorio.unesp.br/handle/11449/130388
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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