Please use this identifier to cite or link to this item:
http://acervodigital.unesp.br/handle/11449/15208
- Title:
- Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface
- Universidade Estadual Paulista (UNESP)
- Inst Fed Parana IFPR
- Univ Tecnol Fed Parana UTFPR
- 0143-7496
- The purpose of this study was to evaluate stress distribution in the hybrid layer produced by two adhesive systems using three-dimensional finite element analysis (FEA). Four FEA models (M) were developed: Mc, a representation of a dentin specimen (41 x 41 x 82 mu m) restored with composite resin, exhibiting the adhesive layer, hybrid layer (HL), resin tags, peritubular dentin, and intertubular dentin to simulate the etch-and-rinse adhesive system; Mr, similar to Mc, with lateral branches of the adhesive; Ma, similar to Mc, however without resin tags and obliterated tubule orifice, to simulate the environment for the self-etching adhesive system; Mat, similar to Ma, with tags. A numerical simulation was performed to obtain the maximum principal stress (sigma(max)). The highest sigma(max) in the HL was observed for the etch-and-rinse adhesive system. The lateral branches increased the sigma(max) in the HL. The resin tags had a little influence on stress distribution with the self-etching system. (C) 2012 Elsevier Ltd. All rights reserved.
- 1-Jun-2012
- International Journal of Adhesion and Adhesives. Oxford: Elsevier B.V., v. 35, p. 114-119, 2012.
- 114-119
- Elsevier B.V.
- Finite element stress analysis
- Mechanical properties of adhesives
- Dentin bonding agents
- Hybrid layer
- Etch-and-rinse adhesives
- Self-etch adhesives
- http://dx.doi.org/10.1016/j.ijadhadh.2011.11.012
- Acesso restrito
- outro
- http://repositorio.unesp.br/handle/11449/15208
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