SILVER DISSOLUTION ON COPPER-BASED ALLOYS

Adorno, A. T.; Beatrice, CRS; Benedetti, Assis Vicente; Cabot, P. L.

Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/31052

Title:

SILVER DISSOLUTION ON COPPER-BASED ALLOYS

Author(s):

Institution:

UNIV BARCELONA
Universidade Estadual Paulista (UNESP)

ISSN:

0022-2461

Abstract:

Electrical resistivity measurements and scanning electron microscopy was used to study the dissolution of silver on Cu-Ag and Cu-Al-Ag alloys. The results seem to indicate that the dissolution temperature is affected by the addition of aluminium.

Issue Date:

15-Jan-1993

Citation:

Journal of Materials Science. London: Chapman Hall Ltd, v. 28, n. 2, p. 411-414, 1993.

Time Duration:

411-414

Publisher:

Chapman Hall Ltd

Source:

http://dx.doi.org/10.1007/BF00357818

URI:

Access Rights:

Acesso restrito

Type:

outro

Source:

http://repositorio.unesp.br/handle/11449/31052

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