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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/71498
Title: 
The effect of chloride ions and A. ferrooxidans on the oxidative dissolution of the chalcopyrite evaluated by electrochemical noise analysis (ENA)
Author(s): 
Institution: 
Universidade Estadual Paulista (UNESP)
ISSN: 
1022-6680
Abstract: 
It is believed that the dissolution of chalcopyrite (CuFeS2) in acid medium can be accelerated by the addition of Cl- ions, which modify the electrochemical reactions in the leaching system. Electrochemical noise analysis (ENA) was utilized to evaluate the effect of the Cl- ions and Acidithiobacillus ferrooxidans on the oxidative dissolution of a CPE-chalcopyrite (carbon paste electrode modified with chalcopyrite) in acid medium. The emphasis was on the analysis of the admittance plots (Ac) calculated by ENA. In general, a stable passive behavior was observed, mainly during the initial stages of CPE-chalcopyrite immersion, characterized by a low passive current and a low dispersion of the Ac plots, mainly after bacteria addition. This can be explained by the adhesion of bacterial cells on the CPE-chalcopyrite surface acting as a physical barrier. The greater dispersions in the Ac plots occurred immediately after the Cl- ions addition, in the absence of bacteria characterizing an active-state. In the presence of bacteria the addition of Clions only produced some effect after some time due to the barrier effect caused by bacteria adhesion. © (2009) Trans Tech Publications.
Issue Date: 
28-Dec-2009
Citation: 
Advanced Materials Research, v. 71-73, p. 397-400.
Time Duration: 
397-400
Keywords: 
  • Admittance
  • Bioleaching
  • Chalcopyrite
  • Electrochemical noise analysis
  • Acid medium
  • Acidithiobacillus ferrooxidans
  • Bacterial cells
  • Barrier effects
  • Carbon paste electrode
  • Chloride ions
  • Cl- ions
  • Electrochemical Noise Analysis
  • Electrochemical reactions
  • Ferrooxidans
  • Initial stages
  • Oxidative dissolution
  • Passive behavior
  • Physical barriers
  • Acids
  • Adhesion
  • Bacteriology
  • Cell adhesion
  • Chlorine compounds
  • Copper compounds
  • Dispersions
  • Dissolution
  • Electric network analysis
  • Ions
  • Surface chemistry
  • Metal recovery
Source: 
http://dx.doi.org/10.4028/www.scientific.net/AMR.71-73.397
URI: 
Access Rights: 
Acesso restrito
Type: 
outro
Source:
http://repositorio.unesp.br/handle/11449/71498
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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