Please use this identifier to cite or link to this item:
http://acervodigital.unesp.br/handle/11449/71498
- Title:
- The effect of chloride ions and A. ferrooxidans on the oxidative dissolution of the chalcopyrite evaluated by electrochemical noise analysis (ENA)
- Universidade Estadual Paulista (UNESP)
- 1022-6680
- It is believed that the dissolution of chalcopyrite (CuFeS2) in acid medium can be accelerated by the addition of Cl- ions, which modify the electrochemical reactions in the leaching system. Electrochemical noise analysis (ENA) was utilized to evaluate the effect of the Cl- ions and Acidithiobacillus ferrooxidans on the oxidative dissolution of a CPE-chalcopyrite (carbon paste electrode modified with chalcopyrite) in acid medium. The emphasis was on the analysis of the admittance plots (Ac) calculated by ENA. In general, a stable passive behavior was observed, mainly during the initial stages of CPE-chalcopyrite immersion, characterized by a low passive current and a low dispersion of the Ac plots, mainly after bacteria addition. This can be explained by the adhesion of bacterial cells on the CPE-chalcopyrite surface acting as a physical barrier. The greater dispersions in the Ac plots occurred immediately after the Cl- ions addition, in the absence of bacteria characterizing an active-state. In the presence of bacteria the addition of Clions only produced some effect after some time due to the barrier effect caused by bacteria adhesion. © (2009) Trans Tech Publications.
- 28-Dec-2009
- Advanced Materials Research, v. 71-73, p. 397-400.
- 397-400
- Admittance
- Bioleaching
- Chalcopyrite
- Electrochemical noise analysis
- Acid medium
- Acidithiobacillus ferrooxidans
- Bacterial cells
- Barrier effects
- Carbon paste electrode
- Chloride ions
- Cl- ions
- Electrochemical Noise Analysis
- Electrochemical reactions
- Ferrooxidans
- Initial stages
- Oxidative dissolution
- Passive behavior
- Physical barriers
- Acids
- Adhesion
- Bacteriology
- Cell adhesion
- Chlorine compounds
- Copper compounds
- Dispersions
- Dissolution
- Electric network analysis
- Ions
- Surface chemistry
- Metal recovery
- http://dx.doi.org/10.4028/www.scientific.net/AMR.71-73.397
- Acesso restrito
- outro
- http://repositorio.unesp.br/handle/11449/71498
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