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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/76014
Title: 
Why silver deposition is so fast: Solving the enigma of metal deposition
Author(s): 
Institution: 
  • Ulm University
  • Universidade Estadual Paulista (UNESP)
  • Lehrstuhl für Theoretische Chemie
  • Universidad Nacional Del Litoral
  • Universidad Nacional de Cõrdoba
ISSN: 
  • 1433-7851
  • 1521-3773
Sponsorship: 
Deutsche Forschungsgemeinschaft (DFG)
Sponsorship Process Number: 
  • DFG: Schm 344/34-1,2
  • DFG: FOR 1376
Abstract: 
A perfect match: Silver deposition is one of the fastest electrochemical reactions, even though the Ag+ ion loses more than 5 eV solvation energy in the process. This phenomenon, an example of the enigma of metal deposition, was investigated by a combination of MD simulations, DFT, and specially developed theory. At the surface, the Ag+ ion experiences a strong interaction with the sp band of silver, which catalyzes the reaction. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Issue Date: 
22-Jul-2013
Citation: 
Angewandte Chemie - International Edition, v. 52, n. 30, p. 7883-7885, 2013.
Time Duration: 
7883-7885
Keywords: 
  • corrosion
  • metal deposition
  • theoretical electrochemistry
  • Electrochemical reactions
  • MD simulation
  • Metal deposition
  • Perfect matches
  • Silver deposition
  • Solvation energy
  • Strong interaction
  • Catalysis
  • Chemistry
  • Corrosion
  • Deposition
Source: 
http://dx.doi.org/10.1002/anie.201301998
URI: 
Access Rights: 
Acesso restrito
Type: 
outro
Source:
http://repositorio.unesp.br/handle/11449/76014
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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