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http://acervodigital.unesp.br/handle/11449/130388
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DC Field | Value | Language |
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dc.contributor.author | Fraga, M. A. | - |
dc.contributor.author | Massi, M. | - |
dc.contributor.author | Oliveira, I. C. | - |
dc.contributor.author | Cruz, Nilson Cristino da | - |
dc.contributor.author | Santos Filho, S. G. dos | - |
dc.date.accessioned | 2014-05-20T15:32:14Z | - |
dc.date.accessioned | 2016-10-25T21:21:02Z | - |
dc.date.available | 2014-05-20T15:32:14Z | - |
dc.date.available | 2016-10-25T21:21:02Z | - |
dc.date.issued | 2009-01-01 | - |
dc.identifier | http://www.scientific.net/MSF.615-617.327 | - |
dc.identifier.citation | Materials Science Forum, v. 615 617, p. 327-330. | - |
dc.identifier.issn | 0255-5476 | - |
dc.identifier.uri | http://hdl.handle.net/11449/130388 | - |
dc.identifier.uri | http://acervodigital.unesp.br/handle/11449/130388 | - |
dc.description.abstract | Amorphous SiC(x)N(y) films have been deposited on (100) Si substrates by RF magnetron sputtering of a SiC target in a variable nitrogen-argon atmosphere. The as-deposited films were submitted to thermal anneling in a furnace under argon atmosphere at 1000 degrees C for 1 hour. Composition and structure of unannealed and annealed samples were investigated by RBS and FTIR. To study the electrical characteristics of SiC(x)N(y) films, Metal-insulator-semiconductor (MIS) structures were fabricated. Elastic modulus and hardness of the films were determined by nanoindentation. The results of these studies showed that nitrogen content and thermal annealing affect the electrical, mechanical and structural properties of SiC(x)N(y) films. | en |
dc.format.extent | 327-330 | - |
dc.language.iso | eng | - |
dc.publisher | Trans Tech Publications Ltd | - |
dc.source | Scopus | - |
dc.subject | Silicon carbon nitride | en |
dc.subject | Thermal annealing | en |
dc.subject | Resistivity | en |
dc.subject | Elastic modulus | en |
dc.subject | Hardness | en |
dc.title | Electrical and Mechanical Properties of Post-annealed SiC(x)N(y) Films | en |
dc.type | outro | - |
dc.contributor.institution | Instituto Tecnológico de Aeronáutica (ITA) | - |
dc.contributor.institution | Universidade Estadual Paulista (UNESP) | - |
dc.contributor.institution | Universidade de São Paulo (USP) | - |
dc.description.affiliation | Plasmas and Processes Laboratory Technological Institute of Aeronautics | - |
dc.description.affiliation | Plasma Laboratory UNESP, Sorocaba | - |
dc.description.affiliation | University of São Paulo LSI EPUSP, São Paulo | - |
dc.description.affiliationUnesp | UNESP, Departamento de Engenharia de Controle e Automação, Plasma Lab, Sorocaba, Brazil | - |
dc.identifier.doi | http://dx.doi.org/10.4028/www.scientific.net/MSF.615-617.327 | - |
dc.identifier.wos | WOS:000265961100078 | - |
dc.rights.accessRights | Acesso restrito | - |
dc.relation.ispartof | Materials Science Forum | - |
dc.identifier.scopus | 2-s2.0-79251649240 | - |
Appears in Collections: | Artigos, TCCs, Teses e Dissertações da Unesp |
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