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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/130388
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dc.contributor.authorFraga, M. A.-
dc.contributor.authorMassi, M.-
dc.contributor.authorOliveira, I. C.-
dc.contributor.authorCruz, Nilson Cristino da-
dc.contributor.authorSantos Filho, S. G. dos-
dc.date.accessioned2014-05-20T15:32:14Z-
dc.date.accessioned2016-10-25T21:21:02Z-
dc.date.available2014-05-20T15:32:14Z-
dc.date.available2016-10-25T21:21:02Z-
dc.date.issued2009-01-01-
dc.identifierhttp://www.scientific.net/MSF.615-617.327-
dc.identifier.citationMaterials Science Forum, v. 615 617, p. 327-330.-
dc.identifier.issn0255-5476-
dc.identifier.urihttp://hdl.handle.net/11449/130388-
dc.identifier.urihttp://acervodigital.unesp.br/handle/11449/130388-
dc.description.abstractAmorphous SiC(x)N(y) films have been deposited on (100) Si substrates by RF magnetron sputtering of a SiC target in a variable nitrogen-argon atmosphere. The as-deposited films were submitted to thermal anneling in a furnace under argon atmosphere at 1000 degrees C for 1 hour. Composition and structure of unannealed and annealed samples were investigated by RBS and FTIR. To study the electrical characteristics of SiC(x)N(y) films, Metal-insulator-semiconductor (MIS) structures were fabricated. Elastic modulus and hardness of the films were determined by nanoindentation. The results of these studies showed that nitrogen content and thermal annealing affect the electrical, mechanical and structural properties of SiC(x)N(y) films.en
dc.format.extent327-330-
dc.language.isoeng-
dc.publisherTrans Tech Publications Ltd-
dc.sourceScopus-
dc.subjectSilicon carbon nitrideen
dc.subjectThermal annealingen
dc.subjectResistivityen
dc.subjectElastic modulusen
dc.subjectHardnessen
dc.titleElectrical and Mechanical Properties of Post-annealed SiC(x)N(y) Filmsen
dc.typeoutro-
dc.contributor.institutionInstituto Tecnológico de Aeronáutica (ITA)-
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)-
dc.contributor.institutionUniversidade de São Paulo (USP)-
dc.description.affiliationPlasmas and Processes Laboratory Technological Institute of Aeronautics-
dc.description.affiliationPlasma Laboratory UNESP, Sorocaba-
dc.description.affiliationUniversity of São Paulo LSI EPUSP, São Paulo-
dc.description.affiliationUnespUNESP, Departamento de Engenharia de Controle e Automação, Plasma Lab, Sorocaba, Brazil-
dc.identifier.doihttp://dx.doi.org/10.4028/www.scientific.net/MSF.615-617.327-
dc.identifier.wosWOS:000265961100078-
dc.rights.accessRightsAcesso restrito-
dc.relation.ispartofMaterials Science Forum-
dc.identifier.scopus2-s2.0-79251649240-
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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