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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/130547
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dc.contributor.authorBenedetti, Assis Vicente-
dc.contributor.authorSumodjo, P. T. A.-
dc.contributor.authorNobe, K.-
dc.contributor.authorCabot, P. L.-
dc.contributor.authorProud, W. G.-
dc.date.accessioned2014-05-27T11:18:01Z-
dc.date.accessioned2016-10-25T21:21:26Z-
dc.date.available2014-05-27T11:18:01Z-
dc.date.available2016-10-25T21:21:26Z-
dc.date.issued1995-11-01-
dc.identifierhttp://dx.doi.org/10.1016/0013-4686(95)00108-Q-
dc.identifier.citationElectrochimica Acta, v. 40, n. 16, p. 2657-2668, 1995.-
dc.identifier.issn0013-4686-
dc.identifier.urihttp://hdl.handle.net/11449/130547-
dc.identifier.urihttp://acervodigital.unesp.br/handle/11449/130547-
dc.description.abstractThe electrochemical behaviour of Cu, Cu-Al and Cu-Al-Ag alloys in aqueous solutions of NaCl (0.5 M, pH = 3.00) was studied by means of voltammetric methods and electrochemical impedance spectroscopy. The surfaces were examined by SEM and EDX analysis. Cu-Al-Ag alloy shows a potentiodynamic behaviour similar to that of the pure copper electrode while the Cu-Al alloy presents some minor differences. In the active dissolution region the electrodes suffer pitting corrosion and in the other potential regions there are the formation of a passivant film with composition depending on the potential. The impedance responses of the electrodes are discussed. An electrodissolution mechanism is proposed and the effect of the alloying elements upon the impedance response and polarisation curves is explained. The main effects are due to the production of copper and silver chlorides and aluminium oxides/ hydroxides at the corroding interface. The addition of Al or (Al + Ag) increases the corrosion resistance of pure copper. © 1995.en
dc.format.extent2657-2668-
dc.language.isoeng-
dc.publisherElsevier B.V.-
dc.sourceWeb of Science-
dc.subjectAlloy oxidation-
dc.subjectCopper-based alloys-
dc.subjectImpedance studies-
dc.subjectPotentiodynamic-
dc.subjectAlloying elements-
dc.subjectCorrosion-
dc.subjectElectrochemical electrodes-
dc.subjectElectrochemistry-
dc.subjectOxidation-
dc.subjectPitting-
dc.subjectScanning electron microscopy-
dc.subjectSodium chloride-
dc.subjectSolutions-
dc.subjectSpectroscopy-
dc.subjectSurfaces-
dc.subjectX ray diffraction analysis-
dc.subjectAlloy oxidation-
dc.subjectElectrochemical impedance spectroscopy-
dc.subjectPotentiodynamic-
dc.subjectVoltammetric methods-
dc.subjectCopper alloys-
dc.titleElectrochemical studies of copper, copper-aluminium and copper-aluminium-silver alloys: Impedance results in 0.5M NaClen
dc.typeoutro-
dc.contributor.institutionUniversity of California-
dc.contributor.institutionUniversidad de Barcelona-
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)-
dc.description.affiliationDepartment of Chemical Engineering University of California, Los Angeles, CA 90024-
dc.description.affiliationDepartamento de Química Física Universidad de Barcelona, 08028 Barcelona-
dc.description.affiliationDepartamento de Físico-Química Universidade Estadual Paulista, 14800-900 Araraquara-
dc.description.affiliationUnespDepartamento de Físico-Química Universidade Estadual Paulista, 14800-900 Araraquara-
dc.identifier.doi10.1016/0013-4686(95)00108-Q-
dc.identifier.wosWOS:A1995TA15500012-
dc.rights.accessRightsAcesso restrito-
dc.relation.ispartofElectrochimica Acta-
dc.identifier.scopus2-s2.0-0029404603-
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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