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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/130740
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dc.contributor.authorRamos, R. A V-
dc.contributor.authorMilanez, L. F.-
dc.date.accessioned2014-05-27T11:18:03Z-
dc.date.accessioned2016-10-25T21:21:54Z-
dc.date.available2014-05-27T11:18:03Z-
dc.date.available2016-10-25T21:21:54Z-
dc.date.issued1996-01-01-
dc.identifierhttp://dx.doi.org/10.1109/ITHERM.1996.534542-
dc.identifier.citationThermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, p. 31-37.-
dc.identifier.urihttp://hdl.handle.net/11449/130740-
dc.identifier.urihttp://acervodigital.unesp.br/handle/11449/130740-
dc.description.abstractIn this work design criteria for cooling of electronic systems used in a digital transmission equipment are considered. An experimental study using a simulated electronic equipment in which vertically oriented circuit boards are aligned to form vertical channels is carried out. Resistors are used to simulate actual components. The temperature of several components in the printed circuit boards are measured and the influence of the baffles and shields on the cooling effect are discussed. It was observed that the use of the baffles reduce the temperature levels and, the use of shields, although protecting the components from magnetic effects, cause an increase in the temperature levels.en
dc.format.extent31-37-
dc.language.isoeng-
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)-
dc.sourceScopus-
dc.subjectCooling-
dc.subjectDigital communication systems-
dc.subjectElectronics packaging-
dc.subjectHeat shielding-
dc.subjectMagnetic field effects-
dc.subjectThermal effects-
dc.subjectDigital transmission equipment-
dc.subjectPrinted circuit design-
dc.titleAnalysis of the influence of baffles and shields on the cooling of a digital transmission equipmenten
dc.typeoutro-
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)-
dc.description.affiliationDEM/FEIS-UNESP, Ilha Solteira-SP-
dc.description.affiliationUnespDEM/FEIS-UNESP, Ilha Solteira-SP-
dc.identifier.doi10.1109/ITHERM.1996.534542-
dc.identifier.wosWOS:A1996BG06B00004-
dc.rights.accessRightsAcesso restrito-
dc.relation.ispartofThermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference-
dc.identifier.scopus2-s2.0-0029718030-
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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