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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/25374
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dc.contributor.authorRosatto, S. S.-
dc.contributor.authorCabot, P. L.-
dc.contributor.authorSumodjo, PTA-
dc.contributor.authorBenedetti, Assis Vicente-
dc.date.accessioned2014-05-20T14:17:55Z-
dc.date.accessioned2016-10-25T17:40:14Z-
dc.date.available2014-05-20T14:17:55Z-
dc.date.available2016-10-25T17:40:14Z-
dc.date.issued2001-01-15-
dc.identifierhttp://dx.doi.org/10.1016/S0013-4686(00)00685-X-
dc.identifier.citationElectrochimica Acta. Oxford: Pergamon-Elsevier B.V., v. 46, n. 7, p. 1043-1051, 2001.-
dc.identifier.issn0013-4686-
dc.identifier.urihttp://hdl.handle.net/11449/25374-
dc.identifier.urihttp://acervodigital.unesp.br/handle/11449/25374-
dc.description.abstractThe electrochemical behavior in 0.5 M H2SO4 at 25 degreesC of a Cu-Al(9.3 wt%)-Ag(4.7 wt%) alloy submitted to different heat treatments and an annealed Cu- Al(9.7 wt%)-Ag(34.2 wt%) were studied by means of open circuit potential (E-mix) measurements, potentiodynamic polarizations and cyclic voltammetry. SEM and EDX microanalysis were used to examine the changes caused by the electrochemical perturbations. The steady state potentials observed for the studied samples were correlated in terms of the phases present in the alloys surface. The resulting E/I potentiodynamic profiles were explained in terms of the potentiodynamic behavior of pure copper and pure silver. The presence of aluminum decreased the extent of copper oxidation. In the apparent Tafel potential region, two anodic Tafel slopes were obtained: 40 mV dec(-1) in the low potential region and 130 mV dec(-1) in the high potential region, which were related with the electrochemical processes involving copper oxidation. (C) 2001 Elsevier B.V. Ltd. All rights reserved.en
dc.format.extent1043-1051-
dc.language.isoeng-
dc.publisherElsevier B.V.-
dc.sourceWeb of Science-
dc.subjectcopper alloyspt
dc.subjectaluminum alloyspt
dc.subjectsilver alloyspt
dc.subjectcorrosionpt
dc.titleElectrochemical studies of copper-aluminum-silver alloys in 0.5 M H2SO4en
dc.typeoutro-
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)-
dc.contributor.institutionUniv Barcelona-
dc.contributor.institutionUniversidade de São Paulo (USP)-
dc.description.affiliationUniv Estadual Paulista, Inst Quim Araraquara, Dept Fisicoquim, BR-14801210 Araraquara, SP, Brazil-
dc.description.affiliationUniv Barcelona, Dept Quim Fis, LCTEM, Barcelona 08028, Spain-
dc.description.affiliationUniv São Paulo, Inst Quim, BR-05513970 São Paulo, Brazil-
dc.description.affiliationUnespUniv Estadual Paulista, Inst Quim Araraquara, Dept Fisicoquim, BR-14801210 Araraquara, SP, Brazil-
dc.identifier.doi10.1016/S0013-4686(00)00685-X-
dc.identifier.wosWOS:000166653900011-
dc.rights.accessRightsAcesso restrito-
dc.relation.ispartofElectrochimica Acta-
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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