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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/31052
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dc.contributor.authorAdorno, A. T.-
dc.contributor.authorBeatrice, CRS-
dc.contributor.authorBenedetti, Assis Vicente-
dc.contributor.authorCabot, P. L.-
dc.date.accessioned2014-05-20T15:19:36Z-
dc.date.accessioned2016-10-25T17:52:31Z-
dc.date.available2014-05-20T15:19:36Z-
dc.date.available2016-10-25T17:52:31Z-
dc.date.issued1993-01-15-
dc.identifierhttp://dx.doi.org/10.1007/BF00357818-
dc.identifier.citationJournal of Materials Science. London: Chapman Hall Ltd, v. 28, n. 2, p. 411-414, 1993.-
dc.identifier.issn0022-2461-
dc.identifier.urihttp://hdl.handle.net/11449/31052-
dc.identifier.urihttp://acervodigital.unesp.br/handle/11449/31052-
dc.description.abstractElectrical resistivity measurements and scanning electron microscopy was used to study the dissolution of silver on Cu-Ag and Cu-Al-Ag alloys. The results seem to indicate that the dissolution temperature is affected by the addition of aluminium.en
dc.format.extent411-414-
dc.language.isoeng-
dc.publisherChapman Hall Ltd-
dc.sourceWeb of Science-
dc.titleSILVER DISSOLUTION ON COPPER-BASED ALLOYSen
dc.typeoutro-
dc.contributor.institutionUNIV BARCELONA-
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)-
dc.description.affiliationUNIV BARCELONA,FAC QUIM,DEPT QUIM FIS,E-08028 BARCELONA,SPAIN-
dc.identifier.doi10.1007/BF00357818-
dc.identifier.wosWOS:A1993KM82300020-
dc.rights.accessRightsAcesso restrito-
dc.relation.ispartofJournal of Materials Science-
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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