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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/36513
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dc.contributor.authorBaldan, C. A.-
dc.contributor.authorShigue, C. Y.-
dc.contributor.authorRuppert, E.-
dc.contributor.authorOliveira, U. R.-
dc.date.accessioned2014-05-20T15:26:20Z-
dc.date.accessioned2016-10-25T18:00:55Z-
dc.date.available2014-05-20T15:26:20Z-
dc.date.available2016-10-25T18:00:55Z-
dc.date.issued2005-06-01-
dc.identifierhttp://dx.doi.org/10.1109/TASC.2005.849357-
dc.identifier.citationIEEE Transactions on Applied Superconductivity. Piscataway: IEEE-Inst Electrical Electronics Engineers Inc., v. 15, n. 2, p. 3552-3555, 2005.-
dc.identifier.issn1051-8223-
dc.identifier.urihttp://hdl.handle.net/11449/36513-
dc.identifier.urihttp://acervodigital.unesp.br/handle/11449/36513-
dc.description.abstractDuring the winding process of HTS coils the tapes of Bi-2223 are subjected to the influence of bending strain, axial strain, compressive force and torsional deformation resulting in I-c degradation. In the literature the effects of the individual strain components are separately analyzed in spite of during coil winding and energizing the strain-stress effects are combined. In this work using commercial tapes of Bi-2223 Ag/AgMg with and without stainless steel reinforcement several samples were wound on cylindrical FRP G-10 holder in which different combined strains are applied. Measurements of I - V characteristic curves are done to determine the degree of critical current degradation and the operational limits. The results are compared with the I, values of short samples and other specimens subjected to deformation generated by loading types such as tensile and bending strain.en
dc.format.extent3552-3555-
dc.language.isoeng-
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)-
dc.sourceWeb of Science-
dc.subjectBi-2223 tapespt
dc.subjectcritical currentpt
dc.subjectHTS coilspt
dc.subjectI-cpt
dc.subjectdegradationpt
dc.subjectstress-strainpt
dc.titleEffect of mechanical loading on the I-c degradation behavior of Bi-2223 tapesen
dc.typeoutro-
dc.contributor.institutionUniversidade de São Paulo (USP)-
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)-
dc.contributor.institutionUniversidade Estadual de Campinas (UNICAMP)-
dc.description.affiliationDEMAR, Dept Mat Engn, FAENQUIL, Fac Engn Quim Lorena, Lorena, SP, Brazil-
dc.description.affiliationUNESP, Fac Engn Guaratingueta, Guaratingueta, SP, Brazil-
dc.description.affiliationUniv Estadual Campinas, Fac Engn Eletr & Computac, Campinas, SP, Brazil-
dc.description.affiliationUnespUNESP, Fac Engn Guaratingueta, Guaratingueta, SP, Brazil-
dc.identifier.doi10.1109/TASC.2005.849357-
dc.identifier.wosWOS:000229767200283-
dc.rights.accessRightsAcesso restrito-
dc.relation.ispartofIEEE Transactions on Applied Superconductivity-
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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