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dc.contributor.authorShigue, Carlos Y.-
dc.contributor.authordos Santos, Rafaela G. S.-
dc.contributor.authorde Abreu, Mariane M. S. P.-
dc.contributor.authorBaldan, Carlos A.-
dc.contributor.authorRobin, Alain L. M.-
dc.contributor.authorRuppert-Filho, Ernesto-
dc.identifier.citationIEEE Transactions on Applied Superconductivity. Piscataway: IEEE-Inst Electrical Electronics Engineers Inc., v. 16, n. 2, p. 1786-1789, 2006.-
dc.description.abstractDielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation processes as well as in quality control. In this work we present the quantitative evaluation of the viscosity changing and the curing kinetics for a commercial Stycast epoxy resin system at different temperatures through the impedance analysis. The results showed correlation between the real component of the complex impedance and the isothermal reaction extent. Comparing the dielectric analysis result with the viscosity measured by rotational rheometer we observed a similar behavior reported for dynamic mechanic analysis. The results comparison have shown that the kinetics parameters obtained from DSC and DETA analysis showed different sensitivities related to the characteristics of curing stages. We concluded that the dielectric thermal analysis should be applied in quantitative evaluation of cure kinetics.en
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)-
dc.sourceWeb of Science-
dc.subjectcomplex impedancept
dc.subjectcuring extent degreept
dc.subjectepoxy curingpt
dc.subjectdielectric analysispt
dc.subjectthermal analysispt
dc.titleDielectric thermal analysis as a tool for quantitative-evaluation of the viscosity and the kinetics of epoxy resin cureen
dc.contributor.institutionUniversidade de São Paulo (USP)-
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)-
dc.contributor.institutionUniversidade Estadual de Campinas (UNICAMP)-
dc.description.affiliationFAENQUIL, Fac Engn Quim Lorena, Dept Mat Engn, DEMAR, Lorena, SP, Brazil-
dc.description.affiliationUNESP, Fac Engn, Guaratingueta, SP, Brazil-
dc.description.affiliationUniv Estadual Campinas, FEEC, Campinas, SP, Brazil-
dc.description.affiliationUnespUNESP, Fac Engn, Guaratingueta, SP, Brazil-
dc.rights.accessRightsAcesso restrito-
dc.relation.ispartofIEEE Transactions on Applied Superconductivity-
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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