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Please use this identifier to cite or link to this item: http://acervodigital.unesp.br/handle/11449/40277
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dc.contributor.authorRangel, Elidiane C.-
dc.contributor.authorMachida, Munemasa-
dc.contributor.authorDurrant, Steven F.-
dc.contributor.authorCruz, Nilson C.-
dc.date.accessioned2014-05-20T15:31:01Z-
dc.date.accessioned2016-10-25T18:06:44Z-
dc.date.available2014-05-20T15:31:01Z-
dc.date.available2016-10-25T18:06:44Z-
dc.date.issued2012-02-01-
dc.identifierhttp://dx.doi.org/10.1109/TPS.2011.2178272-
dc.identifier.citationIEEE Transactions on Plasma Science. Piscataway: IEEE-Inst Electrical Electronics Engineers Inc, v. 40, n. 2, p. 492-496, 2012.-
dc.identifier.issn0093-3813-
dc.identifier.urihttp://hdl.handle.net/11449/40277-
dc.identifier.urihttp://acervodigital.unesp.br/handle/11449/40277-
dc.description.abstractThis paper describes a new plasma treatment method: the plasma expander. In this approach, expanding shock waves are generated in a vacuum chamber by pulsed plasmas. Collisions of fast species in the waves modify the properties of solid surfaces exposed to the plasma. The degree of such modification is governed by the energy delivered by the plasma exposure. To confirm the efficacy of this approach, modifications induced in the properties of thin polymer films produced by plasma-enhanced chemical vapor deposition by exposure to nitrogen plasma shock waves were investigated. The films were prepared from benzene radio frequency plasmas and subsequently exposed to different quantities of nitrogen shock waves N-w. The effects of N-w on the wettability, molecular structure, and mechanical properties of the films were studied. Fourier transform infrared spectroscopy revealed that greater N-w resulted in the loss of C-H groups and the rupture of benzene aromatic rings observed in the structure of the as-deposited films. Furthermore, the contact angle strongly increased and the hardness, evaluated by nanoindentation, increased up to fourfold with the increase in the intensity of the treatment.en
dc.description.sponsorshipFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)-
dc.description.sponsorshipConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)-
dc.format.extent492-496-
dc.language.isoeng-
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)-
dc.sourceWeb of Science-
dc.subjectPlasma-enhanced chemical vapor deposition (PECVD)en
dc.subjectplasma expanderen
dc.subjectplasma treatmenten
dc.subjectsurface treatmenten
dc.subjectthin filmsen
dc.titleA Novel Plasma Technique for Surface Treatment: The Plasma Expanderen
dc.typeoutro-
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)-
dc.contributor.institutionUniversidade Estadual de Campinas (UNICAMP)-
dc.description.affiliationSão Paulo State Univ UNESP, Technol Plasmas Lab, BR-18087180 Sorocaba, Brazil-
dc.description.affiliationUniv Estadual Campinas, Inst Phys Gleb Wataghin, Plasma Phys Lab, BR-13083970 Campinas, SP, Brazil-
dc.description.affiliationUnespSão Paulo State Univ UNESP, Technol Plasmas Lab, BR-18087180 Sorocaba, Brazil-
dc.identifier.doi10.1109/TPS.2011.2178272-
dc.identifier.wosWOS:000300429800011-
dc.rights.accessRightsAcesso restrito-
dc.relation.ispartofIEEE Transactions on Plasma Science-
dc.identifier.orcid0000-0002-4511-3768pt
Appears in Collections:Artigos, TCCs, Teses e Dissertações da Unesp

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