Você está no menu de acessibilidade

Utilize este identificador para citar ou criar um link para este item: http://acervodigital.unesp.br/handle/11449/72848
Título: 
High tech garbage can help engineering colleges to improve hands-on education
Autor(es): 
Lucena, Samuel Euzédice de
Instituição: 
Universidade Estadual Paulista (UNESP)
ISSN: 
  • 1539-4565
  • 0190-5848
Resumo: 
This paper presents a discussion on the potential use of high tech garbage, including electronic waste (e-waste), as a source of mechanisms, sensors and actuators, that can be adapted to improve the reality of microprocessor systems labs, at low cost. By means of some examples, it is shown that entire subsystems withdrawn of high tech equipments can be easily integrated into existing laboratory infrastructure. As examples, first a precision positioning mechanism is presented, which was taken from a discarded commercial ink jet printer and interfaced with a microprocessor board used in the laboratory classes. Secondly, a read/write head and its positioning mechanism has been withdrawn of a retired CD/DVD drive and again interfaced with the microprocessor board. Students who have been using these new experiments strongly approve their inclusion in the lab schedules. © 2011 IEEE.
Data de publicação: 
1-Dez-2011
Citação: 
Proceedings - Frontiers in Education Conference, FIE.
Palavras-chaves: 
  • Hands-on education
  • Electrical engineering labs
  • High tech garbage
  • Electronic waste
  • Optical encoders
Fonte: 
http://dx.doi.org/10.1109/FIE.2011.6142725
Endereço permanente: 
Direitos de acesso: 
Acesso restrito
Tipo: 
outro
Fonte completa:
http://repositorio.unesp.br/handle/11449/72848
Aparece nas coleções:Artigos, TCCs, Teses e Dissertações da Unesp

Não há nenhum arquivo associado com este item.
 

Itens do Acervo digital da UNESP são protegidos por direitos autorais reservados a menos que seja expresso o contrário.